Martview RB-01 Reballing Stencil Tin Net Full Set for EMMC/EMCP/UFS BGA153/162/169/186/221/254 With Fixed Plate and Holder

Black reballing stencil net design, black and white contrast The black meshes are in sharp contrast with the white solder joints of the chip, which makes it possible to see the alignment more clearly

The black stencil net has good light absorption properties, which can effectively reduce visual fatigue, will bring you a different feeling of planting tin

High-temperature resistance and abrasion resistance Imported alloy steel, metal fatigue resistance, make the product use more durable

Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.

High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints

The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.

Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape

High precision, no burrs, so that every mesh can be of the same size and not stuck

Double magnet, super magnetic, accurate positioning without shaking

With fixing plate and holder

Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254

Stencil net thickness: 0.15mm

Support IC Size: 11.5x13mm , 12x16mm

Holder size: 80*80*15mm

Packing size: 89*89*32mm