Sale!

MiJing K23 Mini Multifunction Mainboard Maintenance Fixture with IC Location for iPhone

 4,700

Compare

The MiJing K23 Mini Multifunction Mainboard Maintenance Fixture with IC Location for iPhone is a compact and versatile tool designed for repairing and maintaining iPhone mainboards. It features precise IC location points, making it easier to identify and work on specific components. With its multifunctional design, it enables efficient and accurate repairs, making it an essential tool for technicians and enthusiasts alike in the field of iPhone maintenance.

Description

MiJing K23 Mini Multifunction Mainboard Maintenance Fixture with IC Location for iPhone

Features:

  • New design of glue removal slot, larger, more stable, and easier to use
  • Add functional combination areas, chip storage slots, iPhone CPU de-gluing area, and multi-functional chip fixing area
  • Deepen V-shaped groove dislocation fixed angle, reasonable avoidance, tight clamping
  • High temperature resistant synthetic stone panel, anti-static, anti-corrosion
  • Chip heat dissipation design, suitable for multi-functional clamping such as motherboard welding/chip glue removal/board moving repair, etc
  • High-temperature resistance/Precise positioning/Misplaced buckle/Clamp firmly
  • Suitable for all kinds of traditional/special-shaped motherboards, multiple misaligned buckles make the clamping and fixing more stable and firm, and not easy to deform
  • Support different maintenance needs, suitable for motherboard welding/chip glue removal/board moving repair/camera repair and clamping
  • Independent slide design, universal mobile phone repair clamp, using slide rail fixation design to meet the needs of motherboards of different shapes

Package includes:

  • 1 x Fixture

Additional information

Weight .300 kg
Dimensions 15 × 9.5 × 1.7 cm

Reviews

There are no reviews yet.

Be the first to review “MiJing K23 Mini Multifunction Mainboard Maintenance Fixture with IC Location for iPhone”

Your email address will not be published. Required fields are marked *