PD-C AMAOE With Magnetic Base Universal Reballing Set

 5,000

Compare
Category: Tags: ,

Features:

  • Stencil magnetic suction leveling, free hands; scraping tin does not move, more uniform, with the magnet base to use, planting tin is more simple and convenient, not easy drums
  • Innovative slope design, so that the chip is more closely, compatible with thinner chip C, pads do not overhang more evenly
  • Good compatibility, suitable for 0.9mm thickness chip, most of the current mobile phone chip auxiliary tin planting
  • Strong expandability, applicable to more than 50mm size stencil, supports Amaoe single CPU mesh, integrated mesh, CPU integrated mesh, and so on.
  • High-temperature resistance, good heat insulation effect, heat insulation pad with adhesion characteristics, non-slip and non-displacement
  • Soft and not easy to deform, good elasticity, can be curled at will, not attenuated deformation for a long time